Consisting of an antenna and a contactless-enabled microchip, inlays are the actual data carriers in an RFID system.OPPIOT is a leading provider of RFID inlays with a wide variety of designs integrating various materials, chip technologies, and frequencies for metal and non-metal environments.

OPPIOT's portfolio comes with an extensive choice of RFID chips that include support for most common RFID standards: ISO/IEC 15693, ISO/IEC 14443, ISO/IEC18000-3, or ISO18006-C EPC Gen2, including NFC Type 1, 2, 3, and 4. Inlays are available with all major chip suppliers including NXP, Infineon, Inside Secure, ST Microelectronics, Broadcom, EM Microelectronics, Alien Technology, Impinj, Sony Felica, and others.

OPPIOT's inlays are produced using advanced flip-chip technology and state-of-the-art, high-volume die-bonding processes with integrated inline quality and process control to guarantee superior quality and optimal performance. These transponders come in a variety of shapes with different antenna designs and materials to meet customer requirements. For individual projects where Identiv's existing inlay designs are not directly applicable, we provide customized purpose-built, high-performance inlays to address specific customer and application needs in order to meet today's and future market demands.

Dry inlay (chip + antenna + epoxy glue + [PET] film) or wet inlay (with adhesive backing) can be directly embedded into third-party products or converted into finished products in a series of applications, including, but not limited to:
* Internet of Things (IoT)
* NFC (e.g., smart posters and billboards)
* Library applications
* Ticketing (e.g., event and transportation)
* Industrial (e.g., automotive and chemical)
* Logistics and supply chain
* Asset management
* Pharmaceutical and medical applications
* Device authentication and counterfeit protection
* Electronic games applications
* Event management
* Wearable items
* Loyalty programs

RFID inlay Benefits
* Proven success on major large-scale projects
* Innovative and flexible bond production processes
* Integrating various standard and special production materials (e.g., high temperature requirements, chemical exposure, or mechanical stress)
* Using customized antenna design and dimensions (e.g., small inlay diameter 8.7 mm or 0.343 in) with a variety of shapes and dimensions available
* Special inlay frequency tuning (e.g., suitable for on metal applications)
* High-capacity manufacturing plant for large volume production (ISO-9001 certified)
* Can provide in-house conversion process to build labels, tags, and ticket applications
* RFID-chip programming options (available at a premium cost)
* Available in a more complex inlay design with dual RFID chips and antennas or in a battery-enabled design (e.g., active inlays).